Semiconductor Spin Coating System

The semiconductor spin Coater utilizes high-speed rotation of the substrate to spread the coating liquid uniformly and form a thin film through centrifugal force. This equipment is used to prepare thin film coatings such as photoresist and insulating layers on substrates like silicon wafers, and it is applied in the thin film deposition steps of microelectronics manufacturing and semiconductor processes.
Selection
When selecting a semiconductor spin Coater, considerations should include substrate size compatibility, speed range and stability, program control precision, material compatibility, coating uniformity requirements, and equipment maintenance costs. Parameters should be configured according to specific process needs to ensure seamless integration with existing production line workflows.

Terms

Standards

Instruments

The Spin Coater is controlled by touch screen, the acceleration range is 100~ 4000rpm/s, and the speed can be automatically corrected by A/K selection. The motor torque is large and the operation is smooth, which is suitable for the assembly line process.

$ 2494.00

Gluing time up to 3000 seconds, speed range of 100 to 10000rpm, acceleration of 100-10000rpm/s, support Vacuum chuck and solenoid valve control gas path, suitable for assembly line process.

$ 1590.00

Using semiconductor temperature control technology implementation +/- 0.1 ℃ accuracy, SC4 rotor only needs 2-16ml sample volume to complete accurate viscosity measurement, support infinitely variable speed and automatic lifting system operation is convenient.

$ 5881.00

The uniform glue time is up to 3000 seconds, the speed range is 100-10000rpm, and the acceleration is 100-10000rpm/s. The solenoid valve is used to control the air path, which is suitable for assembly line processes. The motor torque is large and the operation is smooth.

$ 1364.00

The homogenizing time is up to 3000 seconds, the speed range is 100-10000rpm, and the acceleration is 100-10000rpm/s. It supports multi-stage program control. Vacuum chuck ensures the stability of the substrate and is suitable for assembly line processes.

$ 1493.00

High homogenizing efficiency, support 1-5 stage program control, 3000 seconds per period, speed range 100-10000rpm, acceleration 100-10000rpm/s, solenoid valve control gas path suitable for assembly line process.

$ 1461.00

Measurement range 2-200μm with four stainless steel blades, LED display mirror and unique swirl/spin cutting system for accurate measurement of Coating thickness and evaluation of substrate defects.

$ 296.00

The uniform glue time can be adjusted from 0 to 240 seconds, the speed range is 100-7000rpm, the four-stage speed controller ensures the uniformity of the coating, the solenoid valve control gas path is suitable for the assembly line process, and the motor torque is large and the operation is smooth.

$ 1138.00

Support 12 sets of program control, uniform glue time up to 3000 seconds, speed range of 100~ 4000 rpm, equipped with Vacuum chuck system to ensure substrate stability, multi-stage speed and time stepless adjustable, improve coating uniformity and process controllability.

$ 2978.00

Support 720 ° positive and negative two-way swirl/spin, completely solving the problem of insufficient one-way mixing; the fully automatic intelligent clamping system applies force accurately according to the size of the barrel; the revolution speed is 100-200rpm, and the rotation speed is 200-400rpm, ensuring uniform and efficient mixing.

$ 2623.00

Integrated viscosity measurement and temperature control function, using semiconductor temperature control technology implementation +/- 0.1 ℃ accuracy, sample volume only 2-16ml, electric lifting system to ensure accurate positioning, support infinitely variable speed and rheological Linear dispersion programming.

$ 5881.00

Using semiconductor refrigeration technology implementation RT + 5~ 100 ℃ Temperature range, temperature control accuracy ≤ +/- 0.5 ℃, with 5 groups of programming functions and module Temperature uniformity ≤ +/- 0.3 ℃, compact design supports a variety of module replacement.

$ 808.00

Using semiconductor refrigeration technology, temperature control accuracy of +/- 0.5 ℃, cooling time only 10 minutes from 25 ℃ to 4 ℃, with automatic fault detection and over-temperature protection function, support a variety of centrifuge tube module selection.

$ 598.00

Using semiconductor Sensor technology, the detection sensitivity can be adjusted to 50PPM methane, Response Time ≤ 1 second, Warm-Up Time is less than 110 seconds, support 9 hours of continuous work, with LED light alarm and low power indication function.

$ 99.00

The uniform glue speed and time can be adjusted steplessly in multiple periods, the motor torque is large and the operation is smooth, the solenoid valve control gas path is suitable for the assembly line process, and an air pump can work with multiple devices at the same time.

$ 3301.00

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