High and Low Temperature Integrated Machine

The high and low temperature integrated machine achieves temperature control from -40℃ to 200℃ through a compressor and heater, providing a stable temperature field for equipment such as reactors and reaction vessels, and is used in scenarios like material aging tests and chemical synthesis.
Selection
When selecting, consider matching the temperature range to experimental needs, focus on cooling power and heating rate, check compatibility with heat transfer media, confirm safety protection features, and compare equipment dimensions and tank capacity to fit the workspace.

Terms

Standards

Instruments

Adopt non-fluorine Compressor refrigeration system, support 200 ℃ high temperature direct start refrigeration. Temperature Uniformity up to +/- 0.05 ℃, equipped with 13L/min domestic circulation pump, realize turbulent uniform temperature field, with low water level and temperature runaway and other multiple protections.

$ 5468.00

Adopt non-heat centrifugal circulating pump to avoid its own heat generation affecting the temperature field, Temperature Uniformity of +/- 0.05 ℃, at 200 degrees high temperature can directly start the Compressor refrigeration, equipped with multiple Safety protection functions such as low water level anti-dry burning.

$ 1865.00

The use of non-heat centrifugal circulation pump to avoid affecting the temperature field, Temperature Uniformity of +/- 0.05 ℃, support 200 degrees of high temperature directly start cooling, domestic circulation system to achieve a high degree of uniformity in the flow field, to ensure a stable liquid environment.

$ 6902.00

The non-heat centrifugal circulation pump is used to avoid its own heat generation affecting the temperature field. Temperature Uniformity reaches +/- 0.05 ° C. At a high temperature of 200 ° C, the Compressor can be directly started for refrigeration without damaging the core components of the equipment.

$ 2223.00

The fluorine-free refrigeration system can be directly started at a high temperature of 200 ° C, with a Temperature Uniformity of +/- 0.05 ° C. It is equipped with a heat-free centrifugal pump to avoid its own heat generation affecting the temperature field, and supports multi-stage program temperature control.

$ 4177.00

Temperature range covers -50 to 200 ° C, supports 200 ° C direct start cooling without damaging the Compressor; uses a heat-free centrifugal circulation pump and U-shaped return design to ensure Temperature Uniformity +/- 0.05 ° C; provides a variety of Safety protection such as low water level and temperature runaway alarm.

$ 2044.00

Temperature range -40~ 200 ℃, Temperature Uniformity +/- 0.05 ℃, using non-heat centrifugal circulation pump to avoid its own heat generation affecting the temperature field, with multiple Safety protection including low water level anti-dry burning and Compressor overheating protection.

$ 4643.00

Temperature Uniformity +/- 0.05 ℃, 200 degrees of high temperature directly start refrigeration does not damage the Compressor, domestic circulation system without heat centrifugal pump, to avoid affecting the temperature field uniformity.

$ 9144.00

The non-heat centrifugal circulation pump is used to avoid its own heat generation affecting the temperature field. Temperature Uniformity reaches +/- 0.05 ℃, and supports direct start of refrigeration at a high temperature of 200 degrees without damaging the Compressor.

$ 2366.00

Adopt non-heat centrifugal circulation pump to avoid its own heat generation affecting the temperature field, Temperature Uniformity of +/- 0.05 ℃, at 200 ℃ high temperature can directly start the Compressor refrigeration, equipped with multiple Safety protection devices.

$ 3264.00

Adopt non-heat centrifugal circulation pump to avoid its own heat generation affecting the temperature field, Temperature Uniformity of +/- 0.05 ℃, support 200 degrees high temperature direct start cooling without damaging the Compressor, equipped with 13L/min external circulation Flow rate.

$ 3854.00

Adopt non-heat centrifugal circulation pump to avoid its own heat pRoduction, Temperature Uniformity +/- 0.05 ℃, support 200 degrees high temperature direct start cooling without damaging the Compressor, equipped with 13L/min external circulation Flow rate to ensure stable insulation field.

$ 2671.00

The use of non-heat centrifugal circulating pump to avoid affecting the temperature field, Temperature Uniformity of +/- 0.05 ℃, at 200 ℃ high temperature can directly start the Compressor refrigeration, equipped with multiple Safety protection devices to ensure stable operation.

$ 1506.00

The use of non-heat centrifugal circulation pump to avoid their own heat impact temperature field, Temperature Uniformity +/- 0.05 ℃, at 200 ℃ high temperature can directly start the Compressor refrigeration without damage to equipment, equipped with multiple Safety protection devices.

$ 3451.00

The non-heat centrifugal circulation pump is used to avoid its own heat generation affecting the temperature field. Temperature Uniformity is up to +/- 0.05 ° C. At a high temperature of 200 ° C, the Compressor can be directly started for refrigeration without damaging the equipment. Flow rate of 13L/min pump is equipped to ensure fluid circulation efficiency.

$ 6948.00

Articles

Rapid temperature change high and low temperature test chamber for thermal fatigue evaluation of PCB board solder joints.
This paper discusses the application of rapid temperature change high and low temperature test chambers in evaluating the thermal fatigue of PCB board solder joints. Solder joint fatigue is primarily caused by differences in material thermal expansion, and the test chamber simulates thermal stress through temperature cycling to accelerate the fatigue process.
Application of Three-Chamber High and Low Temperature Test Chambers in Rapid Temperature Cycling for Electronic Products
The three-chamber high-low temperature test chamber is used for reliability testing of electronic products, enabling rapid temperature transitions through independent high temperature, low temperature, and test zones. Compared to traditional single-chamber equipment, it reduces temperature change time and enhances testing efficiency.
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This article introduces how to use a high-low temperature alternating test chamber to determine the low-temperature brittleness temperature of plastics.
Thermal Shock Test Chamber Measures Film's Temperature Change Resistance
The thermal shock test chamber creates thermal stress inside the film by rapidly switching between high and low temperature environments, testing its resistance to temperature changes. During the test, key parameters such as temperature range and dwell time need to be set, and the film is observed for issues such as cracking or performance degradation.
Thermal Shock Test Chamber Evaluates Coating Thermal Stability
The thermal shock test chamber simulates sudden temperature changes by rapidly switching between high and low temperature environments, used to evaluate the thermal stability of coatings. In practical applications, coatings may develop internal stresses due to drastic temperature fluctuations, leading to issues such as cracking and peeling.
The necessity of explosion-proof high and low temperature test chambers in lithium battery testing
Lithium batteries pose a risk of thermal runaway or even explosion when tested under extreme temperatures. Explosion-proof high-low temperature test chambers, designed with pressure relief structures, explosion-proof electrical components, and intelligent monitoring systems, can safely release energy and ensure the safety of the testing process.
Tensile Testing Machine Evaluates High and Low Temperature Tensile Properties of Hot Melt Adhesive
This article introduces how to use a tensile testing machine to test the tensile properties of hot-melt adhesives at different temperatures. The performance of hot-melt adhesives varies with temperature: they may soften at high temperatures and become brittle at low temperatures.
The essential difference between thermal shock test chambers and high-low temperature alternating test chambers.
Both thermal shock test chambers and temperature cycling test chambers are used to test the temperature resistance of products, but their core differences lie in the method and purpose of temperature change.