CATEGORIES

    Low-temperature cycling

    Overview Knowledge Standards Terms
    Low-temperature cycling uses a refrigeration system to maintain a sealed space at a set low temperature, simulating material performance changes under cold conditions. It is commonly applied in scenarios such as paint cold resistance testing and plastic embrittlement point detection, helping to observe product stability in low-temperature states.
    Selection
    When selecting, it is necessary to match the temperature range requirements of the testing material, focusing on the cooling rate and uniformity indicators of the equipment. Consider the compatibility between the tank volume and sample size, and check the environmental friendliness of the refrigerant as well as the safety protection features of the equipment. Also, take into account the energy consumption and maintenance costs for long-term operation.
    type
    Pumping rate
    Air inlet diameter
    Motor power
    Power frequency
    Noise value

    Terms

    High and Low Temperature Stirring Thermostatic Bath
    Cooling Thermostatic Bath
    Low-temperature circulating cooling pump
    Low-Temperature Cooling Circulating Pump
    Freezing Compressor
    Low Temperature Circulating Thermostatic Bath
    Low Temperature Circulating Bath
    Low Temperature Constant Temperature Water Bath
    High and Low Temperature Test Chamber
    Dry Type Low Temperature Thermostat

    Standards

    Active GB/T 26809-2011
    Thermostatic baths and circulators - Refrigerated circulators
    Active GB/T 26808-2011
    Thermostatic baths and circulators - Refrigerated baths
    Active GB/T 32710.2-2016
    Safety requirements for environmental testing and conditioning equipment—Part 2: Refrigerated circulators

    Articles

    Rapid temperature change high and low temperature test chamber for thermal fatigue evaluation of PCB board solder joints.
    This paper discusses the application of rapid temperature change high and low temperature test chambers in evaluating the thermal fatigue of PCB board solder joints. Solder joint fatigue is primarily caused by differences in material thermal expansion, and the test chamber simulates thermal stress through temperature cycling to accelerate the fatigue process.
    Application of Three-Chamber High and Low Temperature Test Chambers in Rapid Temperature Cycling for Electronic Products
    The three-chamber high-low temperature test chamber is used for reliability testing of electronic products, enabling rapid temperature transitions through independent high temperature, low temperature, and test zones. Compared to traditional single-chamber equipment, it reduces temperature change time and enhances testing efficiency.