Overview
Spin Coater is a device used to coat films, gels or Miscellaneous liquid materials on the surface of substrates, working based on the principle of centrifugal force. It has important applications in semiconductor manufacturing, Optical inspection coatings, materials science and other fields, especially in the preparation of films, coating photoresists and other processes.
Features
1. High uniform glue efficiency, easy to use.
2. The glue speed and time are divided into multiple periods and can be adjusted steplessly.
3. The electrical wiring is reliable, the motor runs smoothly, and the torque is high.
4. The suction plate adopts a solenoid valve to control the air path, which is suitable for the assembly line process. An air pump can work with several spinning Coaters at the same time to improve efficiency.
5. High coating uniformity to achieve high mass film or coating.
6. Strong process controllability, providing a wealth of parameter adjustment options.
7. Widely used, suitable for photoresist and Miscellaneous glue coating.
8. Wide swirl/spin speed range, adjustable from low speed to high speed.
9. Equipped with Vacuum chuck system to ensure stable fixation of the substrate.
10. Provides automatic control options with programmable preset parameters.
Principle
The spin Coater uses the swirl/spin motion to distribute the glue evenly on the surface of the substrate by dropping the glue on the swirl/spin substrate to form a film or coating. Centrifugal force diffuses the glue from the center to the outer boundary, and finally forms a uniform coating. Parameters such as swirl/spin speed, time and glue viscosity affect the thickness and uniformity of the film.
Applications
Semiconductor manufacturing, Optical inspection coatings, Materials science
Steps
1. Secure the substrate to the tray and use the Vacuum chuck system to ensure stability.
2. Preset coating parameters by programming, such as swirl/spin speed, time, etc.
3. Drop the glue solution in the center of the substrate.
4. Start the device, spin Coater swirl/spin according to the preset program, so that the glue is evenly distributed.
5. After the coating is completed, stop the device and remove the substrate.
Notice
• Power supply voltage AC200-230V, single phase, Power 200W.
• Vacuum input requirement is 0.06-0 MPa, Flow rate 40 liters/Min or more.
• Check whether the vacuum interface and pipeline connection are firm before use.
• Adjust process parameters such as swirl/spin speed, time, etc. according to the specific application.
• Pay attention to safety during operation to avoid damage caused by high-speed swirling/spinning parts.
