Overview
The NANOUP FlexTest-B-UX-00 large film bending (spring leaf) test system is a high-degree-of-freedom modular test solution designed for the development and verification needs of flexible electronic materials and devices. It aims to solve the problem of insufficient adaptability of traditional rigid test methods in the field of flexible electronics, and to promote the development of the flexible electronics industry by improving development verification efficiency and reducing test costs.
Features
1. Test zero stress
2. No surface friction
3. Support large curvature, large area sample testing
4. Reliability, up to millions of repeability tests
5. Scalable, support multi-station, Optical inspection and electrical performance test auxiliary system
Principle
The product bends the sample through a specific mechanical structure to achieve the bending performance test of flexible materials and devices such as films, coatings, and flexible displays. Its design ensures zero stress and no surface friction during the test process, enabling precise control of bending radius and speed, and supports Reliability verification of high repeability times.
Applications
Bending testing of flexible materials and devices such as thin films, coatings, flexible displays, organic light-emitting devices, flexible solar cells, RFID, Sensors, flat wearable products, FPC, flexible printing circuits, stretch electronics, etc
