Overview
Microcomputer Internal Bond Strength Instrument is mainly used for the determination of the internal bond strength of paper and Cardboard. It is suitable for single-layer and multi-layer paper and Cardboard, including Spreader paper and paper and Cardboard with synthetic polymer film on the surface. It can be used for paper mills and Cardboard mills to conduct tests on the internal bond strength of paper. Not suitable for low Basis Weight, porous, soft or low density paper and Cardboard. Internal Bond Strength refers to the ability of paper and Cardboard to resist interlayer separation, which is a reflection of the internal bonding ability of paper and Cardboard. This test is widely used in multi-layer Cardboard such as box Cardboard, white Cardboard, gray board paper, White Cardboard, etc. in printing and Encasement industries.
Features
1. Microcomputer control, Touchscreen operation
2. Measurement range: A gear (20~ 500) J/m ², B gear (500~ 1000) J/m ²
3. High resolution: 0.1J/m2
4. Adjustable sample holding force: 0~ 40kg/cm2
5. Modular integrated thermal printer
6. Unit can be switched: J/m2, lbf/in2 interchange
Principle
Impact samples were used to determine the ability of paper and Cardboard to resist interlayer separation. Impact force was applied to 25.4 * 25.4mm samples at a 90 ° Impact angle, and the internal bonding strength value was measured to reflect the internal bonding ability of paper and Cardboard.
Applications
Interlayer bonding of bobbin base paper, interlayer bonding of White Cardboard, interlayer bonding of kraft cardboard, interlayer bonding of boxboard paper, aluminum foil
Standards
GB/T 26203-2010、TAPPI T569pm-00、TAPPI T833pm-94
Steps
1. Prepare a 25.4 * 25.4mm sample
2. Set the appropriate sample holding force
3. Select measurement gear
4. Impact testing
5. Read and record test results
6. Use the thermal printer to output data
Notice
• Not suitable for Low Basis Weight, Porous, Soft or Low density Paper and Cardboard
• power requirements AC220V +/- 22V, 50Hz, maximum current 3A
The power supply should be reliably grounded
• Pay attention to choosing the appropriate measurement gear
• The sample size must be 25.4 * 25.4mm
