Overview
Spin Coater is a device based on the principle of centrifugal force for coating thin films, glues or Miscellaneous liquid materials on the surface of substrates. It has important applications in semiconductor manufacturing, Optical inspection coatings, material science and other fields. HuiNuo 12A spin Coater is an experimental spin Coater with a four-stage speed LCD display. Rotation speed stability is +/- 3%, speed range is 100-7000rpm, and vacuum pump is optional.
Features
1. Coating uniformity: By centrifugal force, the glue can be evenly coated on the surface of the substrate to achieve high-mass film or coating.
2. Process controllability: Provides a wealth of parameter adjustment options, such as swirl/spin speed, swirl/spin time, etc., which can be adjusted according to needs to achieve the desired coating effect and film thickness.
3. Wide range of applications: not only suitable for photoresist coating, but also for coating polymer coatings and other Miscellaneous glue, liquid materials or solutions.
4. Wide swirl/spin speed range: Speed adjustment range from 100 to 7000rpm to meet the needs of different Coating thickness and uniformity.
5. Optional Vacuum chuck: Optional vacuum pump to ensure that the substrate is firmly fixed on the tray during the swirl/spin coating process and remains stable.
6. Automatic control: Provides automatic control options that can be programmed to preset coating parameters to automate the coating process.
7. Memory function: It has four speed, time period memory, and eight sets of program (A1-A8) memory functions.
Principle
The Working Principle of spin Coater is to drop the glue on the swirl/spin substrate, and the glue is evenly distributed on the surface of the substrate through swirl/spin motion to form a film or coating. Centrifugal force diffuses the glue from the center to the outer boundary, and finally forms a uniform coating. The thickness and uniformity of the film or coating are affected by parameters such as swirl/spin speed, time, and glue viscosity.
Applications
Semiconductor manufacturing, Optical inspection coatings, Materials science, Thin film prepatives, Lithography
Steps
Select the appropriate mounting diameter according to the substrate size (optional range 10-250mm).
2. Fix the substrate firmly on the tray, and a vacuum pump can be optional to ensure stability.
3. Preset or call the memory program (A1-A8) through the LCD screen, set the swirl/spin speed (100-7000rpm), homogenizing time (0-240s) and other parameters.
4. Place the glue droplet in the center of the substrate.
5. Start the device and apply swirl/spin coating.
6. After the coating is completed, remove the substrate.
Notice
• Process parameters (e.g. swirl/spin speed, time, glue viscosity, drop position) affect Coating thickness, uniformity and mass and need to be adjusted according to the specific application and material.
• Power supply voltage of AC220V 50Hz, Power 200W.
• Equipment acceleration conformity and Rotation speed stability of +/- 3%.
• Dimension of the equipment is 300 * 250 * 230mm (excluding the height of the pot), weight 11kg.
• Optional vacuum pump to enhance substrate fixation effect.
