Overview
NBC-50E Thermal Shock Test Chamber is used for electronic components, automation components, communication components, auto parts, metals, chemical materials, plastics and other industries, defense industry, aerospace, military industry, BGA, PCB substrate, electronic chip IC, semiconductor ceramic and polymer materials. Test the repeated resistance of materials to high and low temperatures and the chemical changes or physical damage of products produced by thermal expansion and contraction, which can confirm the mass of products, from precision ICs to heavy machinery components, as the basis or reference for product improvement.
Features
1. The three-box equipment is divided into three parts: high temperature zone, low temperature zone, and test zone. The test product is placed in the test zone. When the temperature of the high temperature zone or low temperature zone is rushed into the test zone for impact, the test product is static.
2. Adopt touch-sensitive graphic operation interface, easy to operate.
3. Impact mode Apply the wind path switching mode to introduce the temperature into the test area for Thermal Shock test.
4. High Temperature Impact or Low Temperature Impact, the maximum time can reach 999h, and the maximum cycle period can reach 9999 times.
5. The system can be used as an automatic cycle engine or manual selective Impact can be set to zone 2 or zone 3 Impact and cold, heavy and hot start.
6. Chill down adopts binary freezing system, the cooling effect is fast, and the chilling down method is water-cooled.
Principle
The equipment adopts a three-box structure, which is divided into a high temperature zone, a low temperature zone and a test zone. The test product is statically placed in the test zone, and the high temperature or low temperature is introduced into the test zone for Impact through the switching of the air path to achieve alternating hot and cold testing.
Applications
Electronics components, automation components, communication components, auto parts, metals, chemical materials, plastics, defense industry, aerospace, military industry, BGA, PCB substrate, electronic chip IC, semiconductor ceramic, polymer materials
Standards
GB-2423.1-89 (EC68-2-1), GB-2423.2-89 (IEC68-2-2), GJB360.8-87 (MIL-STD-202F), GBJ150.3 (MIL-STD-810D), GJB150.4 (MIL-STD-810D), GJB150.3-86, GJB150-86, GJB150.5-86
Notice
• The equipment adopts overheating protection, Compressor overload protection device, control system overload protection, high and low voltage protection switch and other safety devices.
• Power supply voltage is AC 380V, 3-phase, 5-wire, need to ensure that the power supply matches.
• The chill down method is water-cooled, and attention should be paid to the maintenance of the chill down system.
