Overview
NBC-80E Thermal Shock Test Chamber is used for electronic components, automation components, communication components, auto parts, metals, chemical materials, plastics and other industries, defense industry, aerospace, military industry, BGA, PCB substrate, electronic chip IC, semiconductor ceramic and polymer materials. The device tests the repeated resistance of materials to high and low temperatures and the chemical changes or physical damage caused by thermal expansion and contraction of products, which can confirm the mass of products, from precision ICs to heavy mechanical components, as the basis or reference for product improvement.
Features
1. The three-box equipment is divided into three parts: high temperature area, low temperature area, and test area. The test products are placed in the test area for static impact.
2. Adopt touch graphic operation interface, easy to operate
3. Impact mode Apply wind path switching to introduce temperature into the test area for Thermal Shock test
4. High or low temperature Impact maximum time up to 999h, maximum cycle up to 9999 times
5. The system can be used as an automatic cycle engine or manual selective Impact, and can be set to start zone 2 or zone 3 Impact and cold, heavy and hot
6. The chilling down adopts binary freezing system, the cooling effect is fast, the chilling down method is water-cooled, and the impact can be tested at room temperature
Principle
The equipment adopts a three-box structure, which is divided into a high temperature zone, a low temperature zone and a test zone. The test products are placed in the test zone, and the temperature of the high temperature zone or the low temperature zone is rushed into the test zone for Impact test through the switching of the air path, so as to realize the environment simulation of alternating hot and cold.
Applications
Electronics components, automation components, communication components, auto parts, metals, chemical materials, plastics, defense industry, aerospace, military industry, BGA, PCB substrate, electronic chip IC, semiconductor ceramic, polymer materials
Standards
GB-2423.1-89 (EC68-2-1), GB-2423.2-89 (IEC68-2-2), GJB360.8-87 (MIL-STD-202F), GBJ150.3 (MIL-STD-810D), GJB150.4 (MIL-STD-810D), GJB150.3-86, GJB150-86, GJB150.5-86
Notice
• The equipment needs to use AC 380V, 3-phase, 5-wire power supply
• Note that Temperature Fluctuation is +/- 2 ℃, Temperature Error is +/- 2 ℃
Equipment is equipped with overheating protection, Compressor overload protection device, control system overload protection, high and low voltage protection switch and other safety devices
• Use environmentally friendly refrigerant HFC
• The internal and external material is SUS304 stainless steel plate
