Overview
Huinuo 10A-4 touch screen four-station glue leveler is a device specially designed for silicon wafer glue leveling. It is equipped with 4 independent stations, supports 5-100mm diameter (standard 2) silicon wafer processing, and adopts 4.3-inch resistive touch screen control. It has automatic glue leveling process, soft start and exhaust functions.
Features
1. Equipped with 4 independent stations, each station is equipped with a suction cup to fix the silicon wafer, and supports a 40mm diameter (optional 5-100mm) silicon wafer homogenizer.
2. Speed control range 100-7000 rpm, accuracy +/- 1%, soft start stepless adjustable, acceleration setting range 100-3000 rpm.
3. Time control range 0-3000 seconds, accuracy +/- 0.1%, 12 sets of process parameters can be pre-stored, each set of 5 segments.
4. Automatically control the glue process, manually put the silicon wafer and press the start button to complete the operation.
5. Worktable with exhaust function, vacuum and spin coating interlock to ensure safe operation.
6. Each station is displayed and controlled with a 4.3-inch resistive touch screen, with a protective film.
7. Air purification adopts HEPA high-efficiency filtrate technology, with a purification rate of 99.99% and a purification function of 1000 cubic meters per hour.
Principle
The equipment fixes the silicon wafer through the suction cup on the station, uses the soft start mode to control the speed, accelerates from 0 to the set speed (acceleration time 3-80 seconds), automatically executes the homogenization process through the pre-stored process parameters, and the vacuum and spin coating interlock to ensure safe operation. At the same time, the workbench exhaust and air purification system maintains a clean environment.
Applications
Silicon wafer homogenizer, semiconductor manufacturing, microelectronics processing
Standards
HEPA efficient filtrate technical standard
Steps
1. Manually place the silicon wafer on the workstation chuck.
2. Select or set process parameters through the touch screen.
3. Press the start button, and the device automatically completes the glue homogenization process.
4. Remove the silicon wafer after the homogenization is completed.
Notice
• Power supply voltage is AC200-230V single phase.
• Pay attention to the interlocking function of vacuum and spin coating during operation to avoid misoperation.
• Regularly check the Filter and Exhaust system to keep the equipment clean.
• Before use, confirm that the diameter of the silicon wafer is within the range of 5-100mm.
• Avoid use in non-specified environments to prevent affecting the purification effect.
