Overview
Spin Coater is a device for coating film, glue solution or Miscellaneous liquid material on the surface of the substrate. Its Working Principle is based on centrifugal force. It has important applications in semiconductor manufacturing, Optical coating inspection, material science and other fields, especially in the preparation of film, coating photoresist and other processes. 12AC spin Coater is an experimental spin Coater for touch display screen. Acceleration can be adjusted digitally, with a range of 100~ 4000rpm/s. Rotation speed can be automatically corrected by A/K selection Kx practice run. Optional vacuum pump.
Features
1. High uniform glue efficiency, easy to use.
2. The glue speed and time are divided into multiple periods and can be adjusted steplessly.
3. The electrical circuit is reliable, the motor runs smoothly, and the torque is better than the congeneric product.
4. The suction plate adopts a solenoid valve to control the air path, which is suitable for the assembly line process. An air pump can work with several spinning Coaters at the same time.
5. High coating uniformity, high mass film or coating is achieved by centrifugal force.
6. Strong process controllability, providing a wealth of parameter adjustment options such as swirl/spin speed, time, coating position.
7. Widely used, suitable for photoresist coating and Miscellaneous glue, liquid materials.
8. Wide swirl/spin speed range, adjustable from low speed to high speed.
9. Equipped with Vacuum chuck system to ensure stable fixation of the substrate.
10. Provides automatic control options that can be programmed to preset coating parameters.
Principle
The Working Principle of spin Coater is to form a film or coating by dropping the glue on a swirl/spin substrate, and then distributing the glue evenly on the surface of the substrate through swirl/spin motion. Centrifugal force will diffuse the glue from the center to the outer boundary, eventually forming a uniform coating. Parameters such as swirl/spin speed and time and the viscosity of the glue will affect the thickness and uniformity of the film or coating.
Applications
Semiconductor Manufacturing, Optical inspection coatings, Materials Science, Photoresist Spreaders, Boron Coating, polymer coatings, film prepatives
Steps
1. Drop the glue on the swirl/spin substrate.
2. Rotation speed is automatically corrected by selecting Kx practice run through A/K.
3. Adjust swirl/spin speed, time and other parameters.
4. Start the swirling/spinning process to distribute the glue evenly.
5. Optional vacuum pump Vacuum chuck fixed substrate.
Notice
• Coating thickness and uniformity will be affected by swirl/spin speed, time, glue viscosity and other parameters, which need to be adjusted according to specific needs.
• Ensure that the vacuum input requirement is 0.06-0 MPa and the vacuum Flow rate is above 40 liters/Min.
• Power supply voltage is AC200-230V, single phase, 200W.
• The substrate needs to be firmly fixed on the tray to prevent peeling during swirling/spinning.
• Pay attention to safety during operation and avoid contact with high-speed swirling/spinning parts.
