Overview
The interlayer bonding special Sampler is a special sampling device for paper and base paper. It can be used to cut interlayer bonding samples and is used for supporting Interlayer bonding strength Tester sampling. The Sampler is a reliable auxiliary test equipment for industries and departments such as papermaking, Encasement, scientific research and Quality control.
Features
1. Specially designed for cutting samples between paper and base paper layers;
2. Interlayer bonding strength Tester;
3. Applicable to Papermaking, Encasement, Scientific Research and Quality control industries;
The accurate sampling size is 140mmx25.4mm.
5. The sampling thickness can reach ≤ 1mm;
6. Compact shape, light weight about 15kg.
Principle
The Sampler is used to precisely cut the interlayer bonded sample of paper or base paper according to the standard size on a flat and stable working table with a special punching knife sample instrument for subsequent strength measurement.
Applications
Papermaking, Encasement, Research, Quality control
Standards
QB/T 1671 "Physical performance test of paper and Cardboard, general technical conditions for special punching knife-like utensils"
Steps
1. Ensure that the working environment is clean and the workbench is flat and stable;
2. Check Ambient Temperature in the range of 20 ℃ +/- 10 ℃;
3. Place the paper or base paper in the Sampler work area;
4. Operate the Sampler to cut a sample of 140mm x 25.4mm size;
5. Confirm that the thickness of the sample does not exceed 1mm.
6. Use the cut specimen for Internal Bond Strength Determination.
Notice
- Ambient Temperature should be kept at 20 ℃ +/- 10 ℃;
- The relative humidity of the working environment should be less than 85%;
Make sure the workbench is flat and stable.
- The working environment needs to be kept clean;
- The sampling thickness must not exceed 1mm;
- Interlayer bonding strength Tester sampling only.
