Product Overview
This device is specially designed for thin film preparation in the fields of advanced materials, microelectronics, optical coatings, etc. Using High Accuracy digital motor and intelligent program control system, it can stabilize the uniform thin film of nanometer to micron film thickness on various planar substrates such as silicon wafer, Glass, Pottery and porcelain, metal, flexible film, etc. Corrosion-resistant cavity with humanized interface, suitable for laboratory research and development and pilot production scenarios.
Product Features
1, high uniformity, good repeability: speed accuracy of +/- 1 rpm, acceleration can be precisely adjusted, help to maintain the conformity of the film between batches.
2, intelligent program control, process curing: support up to 20 sets of program storage, each group can be set to 5 independent speed and acceleration, commonly used formula one-click call, reduce human error.
3. Strong compatibility, multi-purpose in one machine: standard multi-size vacuum sheet holder, covering small-size substrates to 8-inch substrates; optional high-temperature cavity to achieve "spin coating + baking glue" integrated process.
4. Multi-protection, safe operation: Equipped with multiple safety mechanisms such as automatic shutdown and vacuum pressure alarm to enhance the safety of equipment operation.
Working Principle
High Accuracy digital motor is used to drive the substrate swirl/spin, and the speed and acceleration are precisely controlled through an intelligent program control system. During the substrate swirl/spin process, liquid materials (such as photoresist) are dropwise added to the center of the substrate, and the liquid is evenly spread into a film by centrifugal force. Film thickness and uniformity are controlled by adjusting the speed and acceleration.
application field
Semiconductor field, new energy field, materials science, biomedicine
Operation steps
1. Connect the power supply and turn on the device switch.
2. Place the substrate on the vacuum sheet holder to ensure firm adsorption.
3. Select or preset the process program (including speed, acceleration and segmentation parameters) through the human-machine interaction interface.
4. Drop the desired liquid material into the center of the substrate.
5. Start the program, the device automatically runs the film process.
6. Remove the finished film substrate after stopping.
7. If necessary, use the cleaning function to clean the cavity.
Precautions
- Vacuum chuck before use to avoid substrate peeling.
- The device automatically stops when opening the lid, do not open the cavity cover during operation.
Avoid using highly corrosive liquids beyond the tolerance range of the equipment.
Regularly check the function of the vacuum pressure alarm device.
Wear Protective Gloves and Goggles during operation.
Adhere to laboratory safety procedures to prevent splashing of liquids.
Do not exceed the maximum substrate size specified by the device.
When not in use for a long time, turn off the power and clean the cavity.
