Product Overview
This Spin coater spin coater is designed for pilot R & D and small-scale production, and is suitable for round and Cube substrates of 12 inches (300mm) and below. Using high-torque precision motors and intelligent program control systems, uniform films with nanometer to micron film thickness can be stabilized on large-area flat substrates such as silicon wafers, Glass panels, Pottery and porcelain substrates, and metal sheets. The optimized large-diameter corrosion-resistant cavity takes into account the convenience of operation and process flexibility.
Product Features
1. Suitable for 12 inches, reliable drive: support for φ 300mm (12 inches) substrate, equipped with enhanced brushless motor to ensure smooth start-stop and high-speed spin coating under medium load.
2. Uniform film formation, good repeability: the speed accuracy of +/- 1 rpm, the acceleration can be precisely adjusted, which helps to control the conformity of the film thickness in the large size substrate plane.
3. Intelligent program control, process curing: support up to 20 sets of program storage, each group can set 5 independent speed and acceleration, commonly used formula one-click call, reduce human error.
4. Wide cavity, safe and durable: the inner diameter of the cavity is sufficient (≥ 340mm), matching the 12-inch substrate swirl/spin space; equipped with multiple safety mechanisms such as automatic shutdown after opening the lid and vacuum pressure alarm.
5. Flexible expansion, one machine multi-purpose (optional): optional high temperature cavity (room temperature~ 200 ℃) to achieve "spin coating + baking glue" integrated process, or optional automatic glue pointing system to adapt to different application scenarios.
Working Principle
The device drives the substrate swirl/spin through a high-torque precision motor, and uses centrifugal force to spread the Spreader liquid evenly on the surface of the substrate to form a film of nano to micron thickness. The intelligent program control system precisely controls the speed and acceleration to achieve process curing and repeability.
application field
Semiconductor/pan-semiconductor, new energy, optical coatings, materials science
Operation steps
1. Place the substrate on the cavity stage to ensure that the Vacuum chuck is firm.
2. Select or edit the stored process program (up to 20 groups, each with 5 stages of speed and acceleration).
3. Start the spin coating program, and the equipment runs automatically according to the set parameters.
4. After the process is completed, open the cavity and remove the substrate.
5. Optional high temperature cavity or automatic point glue system for subsequent baking or point glue operation.
Precautions
Make sure the cavity is clean and free of residual liquids or impurities before use.
- The substrate must be firmly adsorbed to prevent peeling during spin coating.
Avoid overload operation and follow equipment specifications.
When maintaining, disconnect the power supply and pay attention to the corrosive protection of chemicals.
If there is any abnormal noise or vibration, stop the machine immediately for inspection.
Adhere to operating procedures to ensure the effectiveness of safety mechanisms.
Regularly check the vacuum system and motor operation status.
- If a high temperature cavity is selected, it should be chilled down to a safe temperature after use.
- Carry out daily maintenance and maintenance in strict accordance with the instructions.
