GB/T 4937.42-2023 is Part 42 of the series of standards for mechanical and climatic tests of semiconductor devices. It specifies the test method for temperature and humidity storage, which is applicable to plastic-encapsulated and other types of packaged semiconductor devices. The standard primarily evaluates the ability of these devices to withstand high-temperature and high-humidity environments, as well as the corrosion resistance of chip metallization interconnects. The standard defines the test conditions, procedures, and requirements for result evaluation. By simulating specific temperature and humidity environments, it accelerates the exposure of potential issues such as leakage caused by moisture penetration. The test requires the use of a constant temperature and humidity chamber (ensuring no water droplets fall on the sample), electrical performance testing equipment, and distilled or deionized water. This standard provides a unified technical basis for the research and development, production quality control, and reliability assessment of semiconductor devices.