GB/T 41852-2022 specifies bending and shear test methods for measuring the adhesion strength between MEMS microstructures and substrates, applicable to micro-scale units with widths and thicknesses ranging from 1 μm to 1 mm. The standard employs columnar specimens, applying bending or shear stresses separately to measure the maximum load at delamination, thereby calculating the adhesion strength. Key instruments include a micro-force testing system, a displacement actuator, an alignment device, and a data recorder. The test requires controlling the blade contact angle and the specimen’s aspect ratio to ensure precise loading direction, providing a unified technical basis for material selection, process optimization, and quality control of MEMS devices.