This standard specifies a destructive test method for determining the effects of vibration on semiconductor devices, particularly those with cavities, within a specified frequency range. The principle involves applying sinusoidal vibration along three axes using a vibration apparatus, with the frequency varying logarithmically between 20 Hz and 2000 Hz. The core testing instrument required for this test is a sweep-frequency vibration test system, supplemented by optical equipment (such as microscopes) and electrical measurement devices for post-test inspection to complete the comprehensive evaluation.
This summary is not the original standard text and is for reference only. For accurate information, please obtain it through official channels.
| Status | Active | ||
|---|---|---|---|
| CCS | L40 | ICS | 31.080.01 |
| Release Date | 2018-09-17 00:00:00 | Implementation Date | 2019-01-01 00:00:00 |
