This standard provides standardized procedures for the operation, packaging, labeling, and transportation of non-hermetically sealed surface-mount devices (SMDs) manufactured using reflow soldering processes before they are put into practical use. Its primary objective is to prevent these moisture-sensitive devices from absorbing moisture during storage and handling, which could lead to package cracking or failure due to internal vapor pressure during subsequent high-temperature soldering. To ensure the safe handling of the devices, the standard includes key measures such as dry packaging, humidity indicator cards, and moisture barrier bags. Its implementation is closely related to the testing standards for classifying the moisture sensitivity levels of devices.