This standard specifies a destructive test method for evaluating the resistance of plastic-encapsulated surface-mount semiconductor devices to soldering heat. Its core objective is to assess the risk of package cracking or electrical performance failure caused by the combined effects of moisture absorption during storage and subsequent exposure to soldering heat. This is achieved by first simulating moisture absorption during storage and then applying soldering heat. The main testing instruments required for this test include a humidity and heat test chamber for simulating the moisture absorption environment and a reflow soldering equipment for simulating the soldering process, which includes types such as infrared convection or vapor phase reflow.