This standard specifies the test procedures for evaluating the solderability of leads on semiconductor device packages when using lead-tin or lead-free solders. The primary test method is the "dip and look" procedure, which is used to assess the solderability of through-hole, axial-lead, and surface-mount devices. Additionally, a reflow soldering procedure simulating board-level assembly may be optionally applied. The standard details the required testing instruments, such as solder pots and wetting balance apparatus for the "dip and look" test, reflow soldering equipment (including reflow systems and stencils, squeegees, etc., related to solder paste printing) to simulate actual assembly environments, as well as steam aging equipment for sample preconditioning and optical equipment for result evaluation.