This standard specifies the standard preconditioning process for non-hermetic surface-mount devices before reliability assessment in the laboratory. This process aims to simulate the environmental stresses, particularly moisture absorption and soldering heat, that devices experience during storage, transportation, and assembly, in order to evaluate their reliability in subsequent long-term use. The implementation of the standard involves various detection instruments, primarily including a precision programmable humidity chamber for simulating moisture absorption, a vapor phase reflow (VPR) chamber or infrared reflow oven for simulating the soldering process, and a temperature cycling chamber for applying mechanical stress. This preconditioning is a critical link between the assessment of a device's moisture sensitivity level and subsequent reliability testing.