Printed Circuit Board Thermal Shock Test Chamber

The printed circuit board thermal shock test chamber simulates the circuit board's tolerance under drastic temperature changes by rapidly switching between high and low-temperature environments. Its principle involves using refrigeration and heating systems to achieve sudden temperature shifts, detecting deformation, cracking, or performance changes in materials due to thermal expansion and contraction. This equipment is used to evaluate the reliability of circuit boards and components, commonly applied in electronic manufacturing and quality control processes.
Selection
When selecting a printed circuit board thermal shock test chamber, considerations should include the temperature range, transition time, chamber volume, and temperature control accuracy. The temperature range should cover the practical application limits, and a short transition time can improve testing efficiency. The chamber volume must accommodate the sample size, and temperature control accuracy affects the reliability of results. Additionally, attention should be paid to equipment stability, energy consumption, and maintenance requirements to ensure compliance with testing standards.

Terms

Standards

Instruments

With 260 * 200 thermal imagery resolution and 70mK thermal Sensitivity, it can quickly locate the abnormal temperature rise point of the circuit board, support -10~ 120 ℃ temperature measurement range, equipped with adjustable lens and multi-directional adjustment bracket, easy to accurately observe the thermal distribution of the circuit board.

$ 1022.00

Using two-box mobile Impact structure, Thermal Shock mechanism moves within 10 seconds, temperature recovery time ≤ 5 minutes, equipped with rigid polyurethane foam insulation material, effective energy saving and waterproof and moisture proof.

$ 23682.00

Using three-box equipment structure, the temperature conversion time does not exceed 10 seconds, the temperature control accuracy reaches +/- 0.5 ℃, and the air circuit switching method realizes fast Thermal Shock, which is suitable for material physical and chemical change testing.

$ 38156.00

Adopt two-box mobile structure, air pressure drive test object Impact, Thermal Shock mechanism moving time within 10 seconds, temperature recovery time within 5 minutes, in line with MIL and other international test standards.

$ 19809.00

The two-box mobile structure is adopted, the Thermal Shock mechanism moves within 10 seconds, and the temperature recovery time is within 5 minutes. It is equipped with HFC environmentally friendly refrigerant and binary ultra-low temperature freezing system, which has high cooling speed and efficiency. It supports paperless recording and real-time Linear dispersion display function.

$ 16840.00

The Three-Box structure is used to distinguish the high temperature zone, the low temperature zone and the test zone, and the air passage is switched to achieve temperature impact. The maximum cycle period is 9999 times, and the Temperature range is -60~ 150 ° C. It supports automatic cycle or manual selective impact.

$ 8695.00

The static test is realized by the Three-Box structure air path switching method, with a maximum impact time of 999 hours and a cycle period of 9999 times. It is equipped with a binary refrigeration system for rapid cooling, and supports automatic cycling or manual selective impact.

$ 12139.00

The three-box structure design is adopted, the temperature conversion time does not exceed 10 seconds, the temperature control accuracy is up to +/- 0.5 ℃, the Thermal Shock test is realized through the air circuit switching, and the touch graphic operation interface is equipped to simplify the operation process.

$ 16759.00

The three-box heat storage structure is used to realize forced air circuit switching, the temperature recovery time is less than or equal to 5 minutes, and the conversion only takes 10 seconds. With independent temperature control in high temperature zone, low temperature zone and test zone, it can perform 2-box or 3-box Impact mode to meet different test needs.

$ 17759.00

The three-box structure design is adopted, the test sample is still in the test area, the temperature recovery time is ≤ 5min, and the conversion time is ≤ 10s. It has three test functions of high temperature, low temperature and Thermal Shock, meeting a variety of standard requirements.

$ 21858.00

Using Three-Box structure air circuit switching technology, Temperature range covers -60 ° C to 150 ° C, the maximum cycle period is 9999 times, with binary refrigeration system to achieve rapid cooling, support automatic cycle and manual Impact mode.

$ 14548.00

The three-box structure is used to achieve static test, the temperature conversion time is ≤ 10 seconds, the temperature recovery is ≤ 5 minutes, the air passage switching mode intRoduces the temperature, and the temperature control accuracy is +/- 0.5 ℃, which is suitable for material thermal expansion and contraction testing.

$ 17275.00

Two-box mobile structure, air pressure driven test object Impact, Thermal Shock mechanism moving time within 10 seconds, temperature recovery time within 5 minutes, in line with MIL, IEC and other specifications, with paperless recording and real-time Linear dispersion display function.

$ 17985.00

The three-box structure realizes independent temperature control in the high temperature and low temperature area, the temperature conversion time is ≤ 10 seconds, the temperature control accuracy is +/- 0.5 ℃, the air circuit switching Impact mode is adopted, and the microcomputer equilibrating temperature control system is equipped.

$ 20712.00

Using a two-box mobile Impact structure, the air pressure drives the test object to move up and down, the Thermal Shock mechanism moves within 10 seconds, and the temperature recovery time is within 5 minutes. Equipped with HFC environmentally friendly refrigerant and ultra-low temperature freezing system, the cooling is fast and efficient.

$ 16840.00

Articles

Thermal shock test chamber measures the thermal shock resistance of polymer films.
This article introduces how to test the thermal shock resistance of polymer films using a thermal shock test chamber. The test involves rapidly switching the film between high and low temperatures to simulate the drastic temperature changes that may occur in actual use, thereby generating thermal stress within the material.
Thermal Shock Test Chamber Measures Film's Temperature Change Resistance
The thermal shock test chamber creates thermal stress inside the film by rapidly switching between high and low temperature environments, testing its resistance to temperature changes. During the test, key parameters such as temperature range and dwell time need to be set, and the film is observed for issues such as cracking or performance degradation.
Thermal Shock Test Chamber Evaluates Coating Thermal Stability
The thermal shock test chamber simulates sudden temperature changes by rapidly switching between high and low temperature environments, used to evaluate the thermal stability of coatings. In practical applications, coatings may develop internal stresses due to drastic temperature fluctuations, leading to issues such as cracking and peeling.
The essential difference between thermal shock test chambers and high-low temperature alternating test chambers.
Both thermal shock test chambers and temperature cycling test chambers are used to test the temperature resistance of products, but their core differences lie in the method and purpose of temperature change.
Technical Differences Between Two-Chamber and Three-Chamber Thermal Shock Test Chambers
The thermal shock test chamber is used to test a product's resistance to sudden temperature changes, primarily through two methods: the two-chamber method and the three-chamber method. What are the differences between them? This article will tell you!
The difference between thermal shock test chambers and constant temperature and humidity chambers
This article compares the differences between thermal shock test chambers and constant temperature and humidity chambers in terms of working principles, key performance, and applications.