Overview
HP-CJQ1000 Interlayer bond strength tester is a professional testing instrument of HENGPIN brand, which is mainly used to measure the Z-direction Tensile Strength (ie, internal bond strength or Internal Bond Strength) of test paper and Cardboard. The instrument uses the sandwich structure of double-sided tape-sample-double-sided tape to hit the aluminum block with a pendulum to destroy the sample in the Z direction, and calculates the energy absorbed during the failure of the sample by measuring the swing high position.
Features
1, full computer control, automatic testing, high accuracy, simple and convenient operation, stable and reliable performance, easy to learn and operate
2. Adopt NXP high-performance ARM core processor and Cirrus dual-channel 24-bit independent high-speed sampling chip to ensure accurate sampling and high-speed computing processing
3.5.7 inch super large full touch LCD screen operation, Chinese menu Operating interface, convenient display and operation
4, automatic measurement of samples, intelligent judgment function, with test signal and Data analysis management, 99 test results automatically saved, data printing, fault alarm and operation prompt function
5. Equipped with a micro printer, it supports single printing and statistical printing, and displays test names, time, number, strength and other indicators
6. Real-time clock function, eliminating the tedious operation of manually entering the date
Principle
The instrument uses the combination of double-sided tape-sample-double-sided tape to form a sandwich structure, which is pressed between a metal flat anvil and an aluminum block. The aluminum block is flipped and destroyed in the Z direction by impacting the inner surface of the upper part of the aluminum block with a pendulum. Finally, the energy absorbed during the destruction of the sample is calculated by measuring the high position of the swing.
Applications
Paper and Cardboard Z-Tensile Strength Testing, Internal Bond Strength Testing, Internal Bond Strength Testing
Standards
GB/T 26203 Paper and Cardboard Determination of internal bond strength (Scott type), TAPPI T-569 internal bond strength (Scott type) correction
Steps
1. Prepare double-sided tape and samples to form a sandwich structure
2. Fix the interlayer between the metal anvil and the aluminum block
3. Set test parameters through Touchscreen
4. Start the instrument, and the pendulum automatically strikes the aluminum block
5. The instrument automatically calculates and displays the test results
6. Optional single or statistical printing of test data
Notice
• Ensure that the power supply is AC220V 3A 50Hz to avoid voltage instability affecting Test accuracy
• Check that all parts of the instrument are in good condition before operation, especially the pendulum and clamping device
• Samples and double-sided tape should be flat and wrinkle-free to ensure uniform sandwich structure
• Avoid touching moving parts during testing to prevent accidental injuries
• Regularly calibrate the instrument to ensure the accuracy of the Measurement range 0~ 1000J/m ²
• Pay attention to number management when saving test data for subsequent query and printing