Overview
TBJ-X2-DJ13 Automatic Film Applicator is a bar drawdown blade Coater with an automatic feeding system, with a large size coating format of 300 * 1000mm and a Vacuum chuck function, which can be used for film proofing on film and aluminum foil copper foil. The device solves the problem of artificial film inconsistency by automatically controlling the speed and pressure of the Spreader, and greatly improves the reproducibility of the film.
Features
1. coating method: bar + drawdown blade + automatic feeding
2. Blade Coating accuracy ： +/- 0.003mm
3. Blade Coating Thickness Range: 0.001~ 10mm Adjustable
4. meyer rod coating thickness range: 1~ 571.5μm
5. meyer rod coating accuracy ： +/- 0.001mm
6. Coating speed: 5~ 200mm/s (< 5mm/s can be customized)
7. effective coating area: 1000 * 300mm (can be customized)
8. Vacuum chuck function
9. Speed control: stepless variable speed
10. Standard automatic inking system
11. Feeding system air source: 0.6Mpa
12. Mixing Tank Volume: 1L
Principle
The Automatic Film Applicator uses a combination of bar and drawdown blade coating method to achieve accurate film through an automatic feeding system. The feeding system adopts the principle of outflow of air source pressure, and controls the amount of material by adjusting the air pressure and the running speed of the discharge port. The equipment controls the Spreader speed through stepless variable speed, and Vacuum chucks fix the substrate to ensure film thickness and uniformity.
Applications
Film, aluminum foil copper foil film proofing
Steps
1. Prepare the substrate and place it on the Spreader stage
2. Vacuum chuck function fixed substrate
3. Set Spreader parameters (speed, thickness, etc.)
4. Start the automatic feeding system
5. Start the Auto Spreader Process
6. Remove the sample after completing the Spreader
Notice
• Make sure the air source pressure is 0.6Mpa before use
• The maximum pressure of the Mixing Tank is 8Mpa
• Spreader speed can be adjusted in the range of 5~ 200mm/s as needed
• Silicone pad and weight can be selected according to the uneven thickness of the substrate
• Customized functions need to be confirmed in advance
