This standard specifies a test method for evaluating the resistance of adhesives to peeling in specific bonded structures, particularly applicable to determining the performance of bonded specimens composed of flexible materials (such as plastic films) adhered to rigid materials (such as metal plates). The core principle of the test involves bending one end of the flexible material by 180°, clamping it together with the rigid specimen in the upper and lower grips of the testing machine, and then separating the grips at a constant rate (typically 100 mm/min) to peel the bonded section. During this process, the peeling force is recorded by a precise measurement system. The key to performing this test is the use of an electronic tensile testing machine (often referred to as a peel strength tester) equipped with specialized fixtures, which can apply and accurately measure the peeling force. This method provides data on the adhesive's resistance to 180° peeling, offering an important basis for evaluating its bonding quality.