This standard specifies destructive evaluation methods for the adhesion integrity between semiconductor chips and their mounts or substrates. The core principle involves using a specialized push-pull tester (also known as a die shear tester) equipped with a contact tool perpendicular to the chip mounting plane. The tool applies a force parallel to the substrate direction along the edge of the chip until the chip detaches, thereby measuring the maximum shear force and evaluating the failure mode. This method is primarily applicable to finished product inspection or process monitoring of cavity-packaged devices but is not suitable for chips with an area greater than 10 mm² or for flip-chip configurations.
This summary is not the original standard text and is for reference only. For accurate information, please obtain it through official channels.
| Status | Active | ||
|---|---|---|---|
| CCS | L40 | ICS | 31.080.01 |
| Release Date | 2018-09-17 00:00:00 | Implementation Date | 2019-01-01 00:00:00 |
