This standard specifies seven test methods for measuring the mechanical strength of internal and external bonds in semiconductor devices. The core principle involves applying a specific directional force (such as tensile, shear, or push-off force) to different bond structures (e.g., internal leads, external leads, or die attachments) until failure occurs, thereby determining their strength. Implementing this standard requires specialized precision instruments, primarily wire bond strength testers (also known as bond testers or push-pull testers). These instruments are equipped with high-precision force sensors, three-axis motion stages, and vision systems, and they perform various test items by interchangeable fixtures such as test hooks or push knives.