With 260 * 200 thermal imagery resolution and 70mK thermal Sensitivity, it can quickly locate the abnormal temperature rise point of the circuit board, support -10~ 120 ℃ temperature measurement range, equipped with adjustable lens and multi-directional adjustment bracket, easy to accurately observe the thermal distribution of the circuit board.
Adopt two-box mobile structure, air pressure drive test object Impact, Thermal Shock mechanism moving time within 10 seconds, temperature recovery time within 5 minutes, in line with MIL and other international test standards.
Using two-box mobile Impact structure, Thermal Shock mechanism moves within 10 seconds, temperature recovery time ≤ 5 minutes, equipped with rigid polyurethane foam insulation material, effective energy saving and waterproof and moisture proof.
Support thermal deformation and Vicat softening point test, Temperature range up to 300 ℃, Temperature control accuracy +/- 0.5 ℃, mechanical mixing and large capacity Tank to ensure uniform insulation field, double control mode operation flexibility.
The transient planar heat source method is used, the test time is not more than 160 seconds, the Sensitivity is 0.00001, and the thermal conductivity of 0.0001 to 50W/(m * K) can be measured. It supports a variety of morphological samples and meets international standards.
Using oil Bath heating medium, Temperature range from room temperature to 200 ℃, temperature control accuracy +/- 0.5 ℃, equipped with sample clamping grid to ensure temperature stability, suitable for various film thermal cissing rate tests.
The two-box mobile structure is adopted, the Thermal Shock mechanism moves within 10 seconds, and the temperature recovery time is within 5 minutes. It is equipped with HFC environmentally friendly refrigerant and binary ultra-low temperature freezing system, which has high cooling speed and efficiency. It supports paperless recording and real-time Linear dispersion display function.
Temperature resolution of 0.1 ℃ and heating rate of 0.1~ 20 ℃/min can be adjusted continuously. It supports hot stage method and visual measurement, and is suitable for the study of thermal characteristics of trace samples.
Temperature resolution is up to 0.1 ℃, heating rate is adjustable from 0.1 ℃ to 20 ℃/min, hot stage method and visual measurement are supported, which is suitable for the study of thermal characteristics of trace samples.
The three-box structure design is adopted, the test sample is still in the test area, the temperature recovery time is ≤ 5min, and the conversion time is ≤ 10s. It has three test functions of high temperature, low temperature and Thermal Shock, meeting a variety of standard requirements.
Temperature range -40 ℃ to + 150 ℃, the temperature conversion time is only 10 seconds, using PID full digital automatic Control system, can quickly detect the material in the extremely high temperature and low temperature continuous environment resistance and thermal expansion and contraction changes.
Using three-box equipment structure, the temperature conversion time does not exceed 10 seconds, the temperature control accuracy reaches +/- 0.5 ℃, and the air circuit switching method realizes fast Thermal Shock, which is suitable for material physical and chemical change testing.
Dynamic Impact is achieved with a two-box mobile structure, with a hot and cold conversion time of 10 seconds and a temperature recovery time of 5 minutes. It is equipped with rigid polyurethane foam insulation material, with ultra-low temperature thermal conductivity and multiple safety protection devices.
Two-box mobile structure, air pressure driven test object Impact, Thermal Shock mechanism moving time within 10 seconds, temperature recovery time within 5 minutes, in line with MIL, IEC and other specifications, with paperless recording and real-time Linear dispersion display function.
Using thermal printing technology, it is designed for use with testing instruments. It can directly connect the color difference Meter and Glossmeter to achieve real-time output of measurement data and report generation.
