High-Low Temperature Cyclic Stress Chamber

The high-low temperature thermal cycling test chamber simulates temperature cycles within a sealed space through compressor cooling and electric heating tube heating. It is used to evaluate the tolerance of materials under alternating temperature environments and is commonly applied in performance verification of electronic components and coating products during transportation and storage.
Selection
When selecting, ensure the temperature range covers actual needs, the temperature change rate matches test standards, and the workspace size accommodates the samples. Confirm temperature uniformity complies with industry norms, the control system is user-friendly, and the equipment structure facilitates maintenance.

Terms

Standards

Instruments

Temperature range -20~ 150 ℃, Temperature Uniformity ≤ +/- 2.0 ℃, using multi-layer conductive film tempered hollow Glass observation window and upper air supply and lower air return mode to ensure stable and reliable test environment.

$ 6496.00

Temperature range -40~ 150 ℃, Temperature Uniformity ≤ +/- 2.0 ℃, using multi-layer conductive film tempered hollow Glass observation window and upper air supply and lower air return mode to ensure stable and reliable test environment.

$ 7948.00

Temperature range -70~ 150 ℃, Temperature Uniformity +/- 2 ℃, using multi-layer conductive film observation window and upper air supply and lower air return system, support 120 sets of program settings and continuous PID control, with multiple safety protection mechanisms.

$ 8093.00

Temperature range -30~ 150 ℃, equipped with multi-layer conductive film tempered hollow Glass observation window and upper air supply and lower air return system, using porcelain frame nickel-chrome wire electric heating device and French Taikang fully enclosed Compressor to ensure Temperature Uniformity ≤ +/- 2.0 ℃.

$ 10336.00

Temperature range -30~ 150 ℃, studio volume 800L, multi-layer conductive film observation window and independent over-temperature protector, with 120 sets of program settings and continuous PID control function.

$ 10336.00

Temperature range -30~ 150 ℃, studio volume 500L, using multi-layer conductive film observation window and PID continuous control, with 120 sets of program settings and multiple safety protection systems to ensure stable and reliable testing.

$ 8900.00

Temperature range -40~ 150 ℃, Temperature Uniformity +/- 1.0 ℃, support high temperature and low temperature alternating cycle test, suitable for pRoduct design improvement and identification inspection.

$ 8497.00

Temperature range -20~ 150 ℃, Temperature Uniformity ≤ +/- 2 ℃, using PID control and multi-layer observation window design, with 120 sets of program settings and over-temperature protection functions, suitable for component stress screening.

$ 5366.00

Temperature range -30~ 150 ℃, Temperature Uniformity ≤ +/- 2 ℃, using PID continuous control mode, with 120 sets of program settings and multiple safety protection systems, suitable for temperature gradual change test and stress screening.

$ 5528.00

Temperature range -60~ 150 ℃, Temperature Uniformity +/- 1.0 ℃, suitable for high temperature and low temperature Reliability test, support aging test, in line with a number of national standards.

$ 6254.00

Temperature range -40~ 150 ℃, Temperature Uniformity +/- 1.0 ℃, support high and low temperature cycle change test, suitable for material performance inspection and aging test, equipped with multiple safety protection devices.

$ 6431.00

Temperature range -60~ 150 ℃, Temperature Uniformity +/- 1.0 ℃, support high temperature and low temperature alternating cycle test, suitable for pRoduct design improvement and aging test, in line with a number of national standards.

$ 6770.00

Temperature range -60~ 150 ℃, Temperature Uniformity +/- 1.0 ℃, suitable for high temperature and low temperature Reliability test, support aging test, in line with a number of national standards.

$ 5947.00

Temperature range -40~ 150 ℃, Temperature Uniformity +/- 2 ℃, using the upper air supply and lower return air mode to ensure uniform temperature, with multi-layer conductive film observation window and independent over-temperature protection system, support 0~ 999 hours timing function.

$ 7287.00

Temperature range -60~ 150 ℃, studio volume 150L, using the upper air supply and lower air return mode and multi-layer conductive film tempered hollow Glass observation window, equipped with independent over-temperature protector and a variety of Safety protection measures.

$ 7609.00

Articles

Rapid temperature change high and low temperature test chamber for thermal fatigue evaluation of PCB board solder joints.
This paper discusses the application of rapid temperature change high and low temperature test chambers in evaluating the thermal fatigue of PCB board solder joints. Solder joint fatigue is primarily caused by differences in material thermal expansion, and the test chamber simulates thermal stress through temperature cycling to accelerate the fatigue process.
Application of Three-Chamber High and Low Temperature Test Chambers in Rapid Temperature Cycling for Electronic Products
The three-chamber high-low temperature test chamber is used for reliability testing of electronic products, enabling rapid temperature transitions through independent high temperature, low temperature, and test zones. Compared to traditional single-chamber equipment, it reduces temperature change time and enhances testing efficiency.
High and low temperature alternating test chamber for measuring low-temperature embrittlement temperature of plastics
This article introduces how to use a high-low temperature alternating test chamber to determine the low-temperature brittleness temperature of plastics.
Thermal Shock Test Chamber Measures Film's Temperature Change Resistance
The thermal shock test chamber creates thermal stress inside the film by rapidly switching between high and low temperature environments, testing its resistance to temperature changes. During the test, key parameters such as temperature range and dwell time need to be set, and the film is observed for issues such as cracking or performance degradation.
Thermal Shock Test Chamber Evaluates Coating Thermal Stability
The thermal shock test chamber simulates sudden temperature changes by rapidly switching between high and low temperature environments, used to evaluate the thermal stability of coatings. In practical applications, coatings may develop internal stresses due to drastic temperature fluctuations, leading to issues such as cracking and peeling.
The necessity of explosion-proof high and low temperature test chambers in lithium battery testing
Lithium batteries pose a risk of thermal runaway or even explosion when tested under extreme temperatures. Explosion-proof high-low temperature test chambers, designed with pressure relief structures, explosion-proof electrical components, and intelligent monitoring systems, can safely release energy and ensure the safety of the testing process.
Tensile Testing Machine Evaluates High and Low Temperature Tensile Properties of Hot Melt Adhesive
This article introduces how to use a tensile testing machine to test the tensile properties of hot-melt adhesives at different temperatures. The performance of hot-melt adhesives varies with temperature: they may soften at high temperatures and become brittle at low temperatures.
The essential difference between thermal shock test chambers and high-low temperature alternating test chambers.
Both thermal shock test chambers and temperature cycling test chambers are used to test the temperature resistance of products, but their core differences lie in the method and purpose of temperature change.