PCB Thermal Shock Test Chamber

The PCB thermal shock test chamber simulates the impact of sudden temperature changes on circuit boards by rapidly switching between high and low temperature environments. Its principle involves automatically transferring samples between independent high-temperature and low-temperature chambers to detect deformation, cracking, or performance changes in materials caused by thermal expansion and contraction. This equipment is used to evaluate the reliability of electronic components under extreme temperature variations and is commonly employed in quality control for fields such as automotive electronics and aerospace.
Selection
When selecting a circuit board thermal shock test chamber, it is essential to consider a temperature range that covers application requirements, a short transition time to ensure rapid thermal shock, and sample capacity that matches the testing scale. The chamber structure should be durable, the control system easy to operate, and the data recording function comprehensive. Additionally, attention should be paid to energy consumption and maintenance costs to ensure long-term stable operation. Verify equipment compatibility by referring to industry standards.

Terms

Instruments

Using two-box mobile Impact structure, Thermal Shock mechanism moves within 10 seconds, temperature recovery time ≤ 5 minutes, equipped with rigid polyurethane foam insulation material, effective energy saving and waterproof and moisture proof.

$ 23682.00

Adopt two-box mobile structure, air pressure drive test object Impact, Thermal Shock mechanism moving time within 10 seconds, temperature recovery time within 5 minutes, in line with MIL and other international test standards.

$ 19809.00

The two-box mobile structure is adopted, the Thermal Shock mechanism moves within 10 seconds, and the temperature recovery time is within 5 minutes. It is equipped with HFC environmentally friendly refrigerant and binary ultra-low temperature freezing system, which has high cooling speed and efficiency. It supports paperless recording and real-time Linear dispersion display function.

$ 16840.00

The three-box structure design is adopted, the test sample is still in the test area, the temperature recovery time is ≤ 5min, and the conversion time is ≤ 10s. It has three test functions of high temperature, low temperature and Thermal Shock, meeting a variety of standard requirements.

$ 21858.00

Using three-box equipment structure, the temperature conversion time does not exceed 10 seconds, the temperature control accuracy reaches +/- 0.5 ℃, and the air circuit switching method realizes fast Thermal Shock, which is suitable for material physical and chemical change testing.

$ 38156.00

Two-box mobile structure, air pressure driven test object Impact, Thermal Shock mechanism moving time within 10 seconds, temperature recovery time within 5 minutes, in line with MIL, IEC and other specifications, with paperless recording and real-time Linear dispersion display function.

$ 17985.00

Using a two-box mobile Impact structure, the air pressure drives the test object to move up and down, the Thermal Shock mechanism moves within 10 seconds, and the temperature recovery time is within 5 minutes. Equipped with HFC environmentally friendly refrigerant and ultra-low temperature freezing system, the cooling is fast and efficient.

$ 16840.00

With three-box structure design, the temperature conversion time is only 10 seconds, the temperature control accuracy is up to +/- 0.5 ℃, and it is equipped with touch graphic operation interface and air passage switching system to achieve fast and stable Thermal Shock testing.

$ 36381.00

The three-box structure design is adopted, the temperature conversion time does not exceed 10 seconds, the temperature control accuracy is up to +/- 0.5 ℃, the Thermal Shock test is realized through the air circuit switching, and the touch graphic operation interface is equipped to simplify the operation process.

$ 16759.00

Adopting a three-box structure design, the temperature recovery time does not exceed 5 minutes, and the temperature conversion is completed within 10 seconds. It is equipped with a touch-sensitive graphic operation interface and an air path switching system to achieve fast and stable Thermal Shock testing.

$ 12660.00

Temperature range -40 ℃ to + 150 ℃, the temperature conversion time is only 10 seconds, using PID full digital automatic Control system, can quickly detect the material in the extremely high temperature and low temperature continuous environment resistance and thermal expansion and contraction changes.

$ 17303.00

Dynamic Impact is achieved with a two-box mobile structure, with a hot and cold conversion time of 10 seconds and a temperature recovery time of 5 minutes. It is equipped with rigid polyurethane foam insulation material, with ultra-low temperature thermal conductivity and multiple safety protection devices.

$ 14564.00

With 260 * 200 thermal imagery resolution and 70mK thermal Sensitivity, it can quickly locate the abnormal temperature rise point of the circuit board, support -10~ 120 ℃ temperature measurement range, equipped with adjustable lens and multi-directional adjustment bracket, easy to accurately observe the thermal distribution of the circuit board.

$ 1022.00

The three-box structure is used to realize the test area is completely static, the temperature conversion time is ≤ 10 seconds, the Temperature range is -55 ℃~ + 150 ℃, and it has 120 sets of program capacity and real-time Linear dispersion recording function.

$ 15032.00

With two-box mobile Impact structure, the temperature recovery time is less than 5 minutes, and the conversion time is only 10 seconds. Equipped with rigid polyurethane foam insulation material, it has ultra-low temperature thermal conductivity and waterproof performance, and supports programmed temperature control.

$ 14564.00

Articles

Thermal shock test chamber measures the thermal shock resistance of polymer films.
This article introduces how to test the thermal shock resistance of polymer films using a thermal shock test chamber. The test involves rapidly switching the film between high and low temperatures to simulate the drastic temperature changes that may occur in actual use, thereby generating thermal stress within the material.
Thermal Shock Test Chamber Measures Film's Temperature Change Resistance
The thermal shock test chamber creates thermal stress inside the film by rapidly switching between high and low temperature environments, testing its resistance to temperature changes. During the test, key parameters such as temperature range and dwell time need to be set, and the film is observed for issues such as cracking or performance degradation.
Thermal Shock Test Chamber Evaluates Coating Thermal Stability
The thermal shock test chamber simulates sudden temperature changes by rapidly switching between high and low temperature environments, used to evaluate the thermal stability of coatings. In practical applications, coatings may develop internal stresses due to drastic temperature fluctuations, leading to issues such as cracking and peeling.
The essential difference between thermal shock test chambers and high-low temperature alternating test chambers.
Both thermal shock test chambers and temperature cycling test chambers are used to test the temperature resistance of products, but their core differences lie in the method and purpose of temperature change.
Technical Differences Between Two-Chamber and Three-Chamber Thermal Shock Test Chambers
The thermal shock test chamber is used to test a product's resistance to sudden temperature changes, primarily through two methods: the two-chamber method and the three-chamber method. What are the differences between them? This article will tell you!
The difference between thermal shock test chambers and constant temperature and humidity chambers
This article compares the differences between thermal shock test chambers and constant temperature and humidity chambers in terms of working principles, key performance, and applications.