Rapid Temperature Cycling Test Machine

The rapid temperature change test chamber achieves high and low temperature cycles for samples within a set time through its refrigeration and heating systems, simulating environments with sudden temperature changes. It is used to test the performance stability of materials under rapid temperature variations and is commonly applied in aging tests for electronic components, coatings, and plastic products.
Selection
When selecting, consider matching the temperature change rate range with testing standards, ensuring the chamber volume accommodates sample dimensions, and the temperature range covers application needs. Focus on the precision and uniformity of the control system, the corrosion resistance of the equipment materials, as well as energy consumption and maintenance costs. Refer to actual testing cases to verify reliability.

Terms

Standards

Instruments

Using 7.0 inch Touchscreen and French Taikang Compressor, temperature range -20~ 150 ℃, humidity range 30~ 98% R.H., with multi-wing air supply circulation and automatic calculation function to ensure uniform distribution of temperature and humidity and rapid stability.

$ 8545.00

The multi-channel mechanical compression refrigeration system is used to achieve rapid temperature change of 10 ° C/min, and the PID adaptive algorithm is equipped to ensure the Temperature Fluctuation +/- 0.5 ° C. The temperature uniformity is guaranteed by the design of the top orifice air supply.

$ 25973.00

Adopt multi-channel mechanical compression refrigeration system and adaptive throttling technology to achieve rapid temperature change of 5 ° C/min; Equipped with PID adaptive algorithm to ensure Temperature Fluctuation +/- 0.5 ° C, through forced air duct system to ensure temperature uniformity.

$ 9836.00

With a linear temperature rise and fall rate of 10 ° C/min and a wide temperature range of -60 to 150 ° C, multi-channel refrigeration system and PID adaptive algorithm are used to achieve rapid temperature convergence, and environmentally friendly refrigerants and low noise design are equipped.

$ 18437.00

Multi-channel mechanical compression refrigeration system and adaptive throttling technology are used to achieve 5 ° C/min linear temperature rise and drop and +/- 0.5 ° C Temperature Fluctuation; equipped with PID adaptive algorithm and forced air duct system to ensure temperature uniformity and rapid convergence.

$ 15210.00

Multi-channel mechanical compression refrigeration system is used to achieve rapid temperature change of 15 ° C/min, equipped with PID adaptive algorithm to ensure Temperature Fluctuation +/- 0.5 ° C, through forced air duct system to ensure Temperature Uniformity ≤ 2 ° C, with remote monitoring function.

$ 28119.00

Adopt multi-channel adaptive refrigeration system to achieve 10 ° C/min rapid temperature change, equipped with PID adaptive algorithm to ensure Temperature Fluctuation +/- 0.5 ° C, through the top orifice plate uniform air supply to ensure temperature uniformity, support 120 groups of program editing and remote monitoring functions.

$ 13064.00

The multi-channel mechanical compression refrigeration system is used to achieve rapid temperature change of 15 ° C/min, and the PID adaptive algorithm is equipped to ensure that the Temperature Uniformity is ≤ 2 ° C, and the 512L studio meets the diverse testing requirements.

$ 31347.00

Using multi-channel mechanical compression refrigeration system and frequency conversion technology, energy consumption is reduced by 20%; with a linear temperature rise and fall rate of 15 ° C/min, Temperature Uniformity ≤ 2 ° C; through forced air duct system and special PID algorithm to achieve rapid temperature convergence and stability control.

$ 15210.00

Adopt multi-channel mechanical compression refrigeration system and frequency conversion technology to achieve rapid temperature change of 5 ° C/min; equipped with PID adaptive algorithm to ensure Temperature Uniformity ≤ 2 ° C, support 120 groups of program editing and remote monitoring functions.

$ 20599.00

Multi-channel mechanical compression refrigeration system is used to achieve rapid temperature change of 10 ° C/min, equipped with PID adaptive algorithm to ensure Temperature Uniformity ≤ 2 ° C, reduce energy consumption and noise through frequency conversion technology, and support 120 sets of program editing and remote monitoring functions.

$ 28119.00

Far infrared radiation heating technology, Temperature range RT +~ 300 ℃, Temperature Fluctuation +/- 2 ℃, equipped with thermistor control thermoMeter, rapid low consumption drying, suitable for a variety of Sample Handling.

$ 1009.00

The multi-channel mechanical compression refrigeration system is used to achieve rapid temperature change of 15 ° C/min, and is equipped with a two-stage throttling system and a forced air duct to ensure temperature uniformity ≤ 2 ° C. Remote visual control and fault self-diagnosis functions are supported through RS485 communication.

$ 20599.00

Conductivity Detector principle and temperature and humidity compensation technology, measurement accuracy of +/- 0.5%, Response Time of 1 second, integrated design supports on-site rapid detection, suitable for a variety of grain moisture measurement.

$ 112.00

Temperature range -20~ 150 ℃, humidity control 30~ 98% R.H., stainless steel liner and ultra-fine Glass insulation cotton, equipped with independent over-temperature protection and multi-layer conductive film observation window to ensure stable and reliable testing.

$ 7771.00

Articles

Rapid temperature change high and low temperature test chamber for thermal fatigue evaluation of PCB board solder joints.
This paper discusses the application of rapid temperature change high and low temperature test chambers in evaluating the thermal fatigue of PCB board solder joints. Solder joint fatigue is primarily caused by differences in material thermal expansion, and the test chamber simulates thermal stress through temperature cycling to accelerate the fatigue process.
Application of Three-Chamber High and Low Temperature Test Chambers in Rapid Temperature Cycling for Electronic Products
The three-chamber high-low temperature test chamber is used for reliability testing of electronic products, enabling rapid temperature transitions through independent high temperature, low temperature, and test zones. Compared to traditional single-chamber equipment, it reduces temperature change time and enhances testing efficiency.
Effect of Rapid Temperature Change Aging Chamber on Thermal Cycling of Composite Materials
This article primarily explores how rapid thermal cycling chambers affect the performance of composite materials during thermal cycling. It explains that thermal cycling can induce internal stresses in composite materials due to differences in the thermal expansion coefficients of their components, potentially leading to microcracks or performance degradation.
Thermal Shock Test Chamber Measures Film's Temperature Change Resistance
The thermal shock test chamber creates thermal stress inside the film by rapidly switching between high and low temperature environments, testing its resistance to temperature changes. During the test, key parameters such as temperature range and dwell time need to be set, and the film is observed for issues such as cracking or performance degradation.
How to Choose the Heating and Cooling Rate for a Rapid Temperature Change Test Chamber
When selecting the heating and cooling rates for a rapid temperature change test chamber, it is essential to comprehensively consider the test standards, product characteristics, and actual engineering requirements. Rates that are too high or too low may affect the test results, making it difficult to accurately evaluate the product's environmental tolerance.