With 260 * 200 thermal imagery resolution and 70mK thermal Sensitivity, it can quickly locate the abnormal temperature rise point of the circuit board, support -10~ 120 ℃ temperature measurement range, equipped with adjustable lens and multi-directional adjustment bracket, easy to accurately observe the thermal distribution of the circuit board.
The static test is realized by the Three-Box structure air path switching method, with a maximum impact time of 999 hours and a cycle period of 9999 times. It is equipped with a binary refrigeration system for rapid cooling, and supports automatic cycling or manual selective impact.
Adopt two-box mobile structure, air pressure drive test object Impact, Thermal Shock mechanism moving time within 10 seconds, temperature recovery time within 5 minutes, in line with MIL and other international test standards.
Using two-box mobile Impact structure, Thermal Shock mechanism moves within 10 seconds, temperature recovery time ≤ 5 minutes, equipped with rigid polyurethane foam insulation material, effective energy saving and waterproof and moisture proof.
Support thermal deformation and Vicat softening point test, Temperature range up to 300 ℃, Temperature control accuracy +/- 0.5 ℃, mechanical mixing and large capacity Tank to ensure uniform insulation field, double control mode operation flexibility.
The transient planar heat source method is used, the test time is not more than 160 seconds, the Sensitivity is 0.00001, and the thermal conductivity of 0.0001 to 50W/(m * K) can be measured. It supports a variety of morphological samples and meets international standards.
Using oil Bath heating medium, Temperature range from room temperature to 200 ℃, temperature control accuracy +/- 0.5 ℃, equipped with sample clamping grid to ensure temperature stability, suitable for various film thermal cissing rate tests.
The two-box mobile structure is adopted, the Thermal Shock mechanism moves within 10 seconds, and the temperature recovery time is within 5 minutes. It is equipped with HFC environmentally friendly refrigerant and binary ultra-low temperature freezing system, which has high cooling speed and efficiency. It supports paperless recording and real-time Linear dispersion display function.
Temperature resolution of 0.1 ℃ and heating rate of 0.1~ 20 ℃/min can be adjusted continuously. It supports hot stage method and visual measurement, and is suitable for the study of thermal characteristics of trace samples.
Temperature resolution is up to 0.1 ℃, heating rate is adjustable from 0.1 ℃ to 20 ℃/min, hot stage method and visual measurement are supported, which is suitable for the study of thermal characteristics of trace samples.
Application width 300mm, Spreader accuracy +/- 0.005mm, Drawdown blade can be quickly disassembled and cleaned, three independent temperature control oven to ensure uniform drying, suitable for a variety of substrates and Stock processing.
Using 405nm wavelength and 0.8W/cm ² optical power density, UVLED output is concentrated, the photoelectric conversion rate is high, and the curing speed is fast; the cold light source has low heat radiation, avoids thermal stress deformation, and is suitable for thermal materials.
The three-box structure design is adopted, the test sample is still in the test area, the temperature recovery time is ≤ 5min, and the conversion time is ≤ 10s. It has three test functions of high temperature, low temperature and Thermal Shock, meeting a variety of standard requirements.
Temperature range -40 ℃ to + 150 ℃, the temperature conversion time is only 10 seconds, using PID full digital automatic Control system, can quickly detect the material in the extremely high temperature and low temperature continuous environment resistance and thermal expansion and contraction changes.
The cuboid studio improves the effective volume utilization rate, the Vacuum Level control range is 10~ 105Pa, the drying time is shortened by more than 50% compared with traditional equipment, and supports programmed vacuum cycling and 7 sets of 63-step temperature programming.
