High-Low Temperature Test Box

The high-low temperature test chamber simulates extreme temperature environments through refrigeration and heating systems, allowing samples to undergo stability testing within the set temperature range. It is used to detect the performance changes of materials under temperature variations and is commonly applied in the verification of temperature resistance for electronic components, automotive parts, and chemical materials.

Instruments

The three-box structure design is adopted, the test sample is still in the test area, the temperature recovery time is ≤ 5min, and the conversion time is ≤ 10s. It has three test functions of high temperature, low temperature and Thermal Shock, meeting a variety of standard requirements.

$ 21858.00

Adopt three-box structure to achieve rapid temperature conversion, conversion time ≤ 10 seconds, temperature control accuracy of +/- 0.5 ℃, equipped with air passage switching system and microcomputer equilibrate temperature control system to ensure test Stability.

$ 24150.00

The three-box structure realizes independent temperature control in the high temperature and low temperature area, the temperature conversion time is ≤ 10 seconds, the temperature control accuracy is +/- 0.5 ℃, the air circuit switching Impact mode is adopted, and the microcomputer equilibrating temperature control system is equipped.

$ 20712.00

The three-box structure is used to realize the static test sample, the heat storage and cold storage design is matched with the forced air circuit switching, the temperature conversion only takes 10 seconds, and the temperature control accuracy reaches +/- 0.5 ℃, which meets the requirements of continuous testing in extremely high temperature and extremely low temperature environment.

$ 17307.00

Adopt three-box heat storage and cold storage structure, temperature conversion time ≤ 10 seconds, Temperature range -65 ℃~ + 150 ℃, with independent temperature control functions in high temperature zone, low temperature zone and test zone, and can perform 2-box or 3-box Impact mode.

$ 20261.00

The three-box structure realizes independent temperature control in the high temperature zone, the low temperature zone and the test zone. The temperature conversion time is within 10 seconds, and the temperature control accuracy reaches +/- 0.5 ° C. The air circuit switching method is used for rapid Impact testing to improve the material testing efficiency.

$ 30217.00

The Three-Box structure is used to distinguish the high temperature zone, the low temperature zone and the test zone, and the air passage is switched to achieve temperature impact. The maximum cycle period is 9999 times, and the Temperature range is -60~ 150 ° C. It supports automatic cycle or manual selective impact.

$ 8695.00

Using a two-box mobile Impact structure, the air pressure drives the test object to move up and down, the Thermal Shock mechanism moves within 10 seconds, and the temperature recovery time is within 5 minutes. Equipped with HFC environmentally friendly refrigerant and ultra-low temperature freezing system, the cooling is fast and efficient.

$ 16840.00

The three-box structure realizes the separation of the high temperature zone, the low temperature zone and the test zone, the air passage switching mode intRoduces the temperature for Impact, the temperature conversion time is ≤ 10 seconds, the temperature control accuracy is +/- 0.5 ℃, and the microcomputer equilibrate temperature control system and the double-stage Compressor chill down.

$ 10240.00

Three-box structure design, temperature conversion time ≤ 10 seconds, temperature recovery time ≤ 5 minutes, equipped with High Accuracy microcomputer control system, can simulate extremely high temperature and extremely low temperature environment for static Impact testing of materials.

$ 22439.00

The independent control structure of the cold and hot box is adopted, with a temperature conversion time of less than 15 seconds and a temperature recovery time of less than 5 minutes. It is equipped with multiple safety interlock protection and standard lead hole design to ensure efficient and safe testing.

$ 34606.00

Adopting independent control design of hot and cold box, the temperature conversion time does not exceed 15 seconds, and the recovery time is within 5 minutes. Equipped with safety interlock function and standard lead hole tube, it enhances test efficiency and operation safety.

$ 29120.00

The three-box structure is used to achieve independent temperature control in the high temperature zone, low temperature zone and test zone, with a temperature conversion time of less than or equal to 10 seconds. It is equipped with rigid polyurethane foam insulation materials and supports 2 or 3 boxes of Impact mode to meet different standard testing requirements.

$ 12757.00

The three-box structure is used to achieve a completely static test zone, with a temperature conversion time of ≤ 10 seconds and a temperature recovery of ≤ 5 minutes. It has an Impact range of 150 ° C in the high temperature zone and -55 ° C in the low temperature zone, meeting the needs of rapid temperature change testing.

$ 24133.00

The three-box heat storage and cold storage structure is adopted to achieve rapid temperature conversion of ≤ 10s, and the temperature recovery time is ≤ 5 minutes. It supports Impact testing at 150 ° C in high temperature zone and -40 ° C in low temperature zone, and has program memory and Linear dispersion recording functions.

$ 17307.00

Articles

Rapid temperature change high and low temperature test chamber for thermal fatigue evaluation of PCB board solder joints.
This paper discusses the application of rapid temperature change high and low temperature test chambers in evaluating the thermal fatigue of PCB board solder joints. Solder joint fatigue is primarily caused by differences in material thermal expansion, and the test chamber simulates thermal stress through temperature cycling to accelerate the fatigue process.
Application of Three-Chamber High and Low Temperature Test Chambers in Rapid Temperature Cycling for Electronic Products
The three-chamber high-low temperature test chamber is used for reliability testing of electronic products, enabling rapid temperature transitions through independent high temperature, low temperature, and test zones. Compared to traditional single-chamber equipment, it reduces temperature change time and enhances testing efficiency.
High and low temperature alternating test chamber for measuring low-temperature embrittlement temperature of plastics
This article introduces how to use a high-low temperature alternating test chamber to determine the low-temperature brittleness temperature of plastics.
Thermal Shock Test Chamber Measures Film's Temperature Change Resistance
The thermal shock test chamber creates thermal stress inside the film by rapidly switching between high and low temperature environments, testing its resistance to temperature changes. During the test, key parameters such as temperature range and dwell time need to be set, and the film is observed for issues such as cracking or performance degradation.
Thermal Shock Test Chamber Evaluates Coating Thermal Stability
The thermal shock test chamber simulates sudden temperature changes by rapidly switching between high and low temperature environments, used to evaluate the thermal stability of coatings. In practical applications, coatings may develop internal stresses due to drastic temperature fluctuations, leading to issues such as cracking and peeling.
The necessity of explosion-proof high and low temperature test chambers in lithium battery testing
Lithium batteries pose a risk of thermal runaway or even explosion when tested under extreme temperatures. Explosion-proof high-low temperature test chambers, designed with pressure relief structures, explosion-proof electrical components, and intelligent monitoring systems, can safely release energy and ensure the safety of the testing process.
The essential difference between thermal shock test chambers and high-low temperature alternating test chambers.
Both thermal shock test chambers and temperature cycling test chambers are used to test the temperature resistance of products, but their core differences lie in the method and purpose of temperature change.